FET, RibbonFET, 3DFET and the Core Ultra 100 and Core Ultra 200 processors from Intel

FET (also known as Foveros) is Intel's new 3D stacking technology that can be found in the new Intel core ultra processors that has NPU that enables AI computing. It allows different types of chips (like CPUs, integrated GPUs, NPU and integrated memory) to be stacked vertically on top of each other, creating a more integrated and efficient system. While the power comes from the other side (from the backside) in stead of on the top, also known as PowerVia. This way their is more space for transistors and better deat dissipation.

FinFET (Fin Field-Effect Transistor)

A type of transistor with a 'fin' shaped channel. This 3D structure improves control over the flow of electrons, leading to better performance and power efficiency compared to older planar transistor designs.

The benefits are Improved Performance by better control over electron flow that translates to faster switching speeds and higher performance. This also reduce Power Consumption. FinFETs operate at lower voltages, reducing power consumption. The smaller size enables smaller transistor sizes, allowing for higher transistor density on a chip.

The key technology of FinFETs have been a cornerstone of Intel's process technology for several generations, enabling significant performance and power efficiency improvements in their processors. Intel continues to refine FinFET technology with each new process node, pushing the limits of transistor performance.

RibbonFET

This is an evolution of Foveros, Ribbon Foveros uses thinner interconnects (like ribbons) to connect the stacked chips. This allows for higher bandwidth and potentially lower power consumption.

3DFET

This refers to the overall 3D stacking approach, encompassing both Foveros and Ribbon Foveros.

Intel Core Ultra Processors

Intel's Core Ultra processors, like the 100 and 200 series, are expected to leverage Intel's advanced packaging technologies, including 3D Foveros.

3D stacking

This 3D integration allows cncreased performance by stacking different types of chips (e.g., high-performance cores with efficient cores, or CPU with integrated GPU), Ultra processors can achieve higher overall performance and improved power efficiency.

3D stacking enables the integration of specialized hardware (like AI accelerators) directly onto the processor package, providing enhanced features like AI processing capabilities.

In essence

FET variations (like RibbonFET) are key enabling technologies for Intel's Ultra processors. By utilizing 3D stacking, Intel aims to deliver significant performance and efficiency gains in its high-end processors, powering the next generation of computing experiences. (source: Google Gemini, reworked byWM)