FET, RibbonFET, 3DFET and the Core Ultra 100 and Core Ultra 200 processors from Intel
FET (also known as Foveros) is Intel's new 3D stacking technology that can be found in the new Intel core ultra processors that has NPU that enables AI computing. It allows different types of chips (like CPUs, integrated GPUs, NPU and integrated memory) to be stacked vertically on top of each other, creating a more integrated and efficient system. While the power comes from the other side (from the backside) in stead of on the top, also known as PowerVia. This way their is more space for transistors and better deat dissipation. FinFET (Fin Field-Effect Transistor) A type of transistor with a 'fin' shaped channel. This 3D structure improves control over the flow of electrons, leading to better performance and power efficiency compared to older planar transistor designs. The benefits are Improved Performance by better control over electron flow that translates to faster switching speeds and higher performance. This also reduce Power Consumption. FinFETs operate at lower volta...